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栢林材料致力于为电子封装领域焊接用金属预成型焊片、焊带和焊丝的研发与生产。我们可以提供一系列不同熔点的焊料成分选择,熔点范围从50到1100°C,焊片最小厚度可达0.01mm,最小精度可达0.005mm,焊带最小宽度0.2mm。典型焊料成分及性能如下表,如需完整合金表,请联系我们的销售代表。
合金材料 | 密度 (g/cm3) | 固相线 (°C) | 共晶温度 (°C) | 液相线 (°C) |
---|---|---|---|---|
In66.3Bi33.7 | 8 | 73 | ||
In52Sn48 | 7.3 | 118 | ||
In50Sn50 | 7.3 | 118 | 122 | |
Bi55Pb45 | 10.43 | 124 | ||
Bi57Sn43 | 8.54 | 138 | ||
In97Ag3 | 7.38 | 144 | ||
In70Pb30 | 8.18 | 160 | 174 | |
In60Pb40 | 8.52 | 174 | 185 | |
Sn77.2In20Ag2.8 | 7.36 | 175 | 187 | |
In50Pb50 | 8.89 | 180 | 209 | |
Sn63Pb37 | 8.37 | 183 | ||
Pb60In40 | 9.29 | 195 | 225 | |
Sn91Zn9 | 7.28 | 199 | ||
Sn95In5 | 7.29 | 215 | 222 | |
Sn90Au10 | 7.77 | 217 | ||
Sn96Ag3.5Cu0.5 | 7.38 | 217 | 218 | |
Sn96.5Ag3.5 | 221 | |||
Sn97.5Sb2.5 | 7.27 | 232 | 237 | |
Pb70In30 | 9.74 | 238 | 253 | |
Sn90Sb10 | 7.22 | 240 | 250 | |
Pb75In25 | 9.97 | 250 | 264 | |
Pb89Sb11 | 10.51 | 252 | ||
Au80Sn20 | 14.52 | 280 | ||
Au79Sn21 | 14.34 | 280 | 290 | |
Pb93Sn7 | 10.94 | 285 | 310 | |
Pb92.5Sn5Ag2.5 | 11.01 | 287 | 296 | |
Pb90In5Ag5 | 10.99 | 290 | 310 | |
Pb90Sn5Ag5 | 10.99 | 292 | ||
Pb95In5 | 11.04 | 292 | 314 | |
Pb97.5Ag2.5 | 11.32 | 304 | ||
Pb92.5In5Ag2.5 | 11.01 | 307 | ||
Au88Ge12 | 14.67 | 356 | ||
Au96.85Si3.15 | 15.7 | 365 | ||
Ag45Au38Ge17 | 10.58 | 525 | ||
Al88Si12 | 2.65 | 577 | ||
Ag72Cu28 | 10.01 | 779 | ||
Ag80Cu20 | 10.14 | 779 | 815 | |
Ag85Cu15 | 10.23 | 779 | 840 | |
Ag50Cu50 | 9.67 | 779 | 870 | |
Ag90Cu10 | 10.31 | 779 | 873 | |
Cu70Ag30 | 9.35 | 779 | 945 | |
Ag95Cu5 | 10.4 | 862 | 910 | |
Au75Cu20Ag5 | 15.15 | 885 | 895 | |
Ag96Cu4 | 10.42 | 885 | 920 | |
Au65Cu35 | 13.76 | 905 | 920 | |
Au80Cu20 | 15.67 | 810 | ||
Au50Cu50 | 12.22 | 955 | 970 | |
Au95Cu5 | 18.27 | 975 | 1005 | |
Cu65Au35 | 11.01 | 980 | 1010 | |
Ag50Au50 | 13.59 | 1000 | 1020 | |
Cu73Au27 | 10.46 | 1025 | 1050 | |
Cu75Au25 | 10.35 | 1030 | 1050 | |
Cu90Au10 | 9.45 | 1063 | 1078 |